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114-93-640-41-117000

¥116.73
IC插座
Mill-Max

CONN IC DIP SOCKET 40POS GOLD

參數(shù)名稱參數(shù)值
Product StatusActive
TypeDIP, 0.6" (15.24mm) Row Spacing
Number of Positions or Pins (Grid)40 (2 x 20)
Pitch - Mating0.100" (2.54mm)
Contact Finish - MatingGold
Contact Finish Thickness - Mating30.0μin (0.76μm)
Contact Material - MatingBeryllium Copper
Mounting TypeSurface Mount
FeaturesOpen Frame
TerminationSolder
Pitch - Post0.100" (2.54mm)
Contact Finish - PostTin-Lead
Contact Finish Thickness - Post200.0μin (5.08μm)
Contact Material - PostBrass Alloy
Housing MaterialPolycyclohexylenedimethylene Terephthalate (PCT), Polyester
Operating Temperature-55°C ~ 125°C

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